Underfill Epoxy

Experience the excellence of our Underfill Epoxy, designed to offer remarkable performance and peerless reliability for your critical applications. With over 16.0 years of industry expertise, we present ECCOBOND E 1216M and ECCOBOND FP4531 Underfill Epoxy as elite solutions, catering to the diverse needs of the domestic market across All India. Personalise your choices with these specially formulated options, ensuring instant savings through enhanced durability and reduced repair costs. These products boast unmatched features such as superior thermal resistance, exceptional mechanical strength, and consistent flow properties for optimal substrate adhesion. Their remarkable capacity to prevent mechanical stress and safeguard delicate electronic components makes them an indispensable choice for demanding environments. Furthermore, their elite curing process ensures seamless application while reinforcing structural integrity like no other. Choose our Underfill Epoxy solutions to experience the synergy of advanced technology and reliable protection, crafted to outperform and deliver unparalleled results every time.

ECCOBOND E 1216M Underfill Epoxy

MOQ : 10 Units

  • Appearance
  • Liquid
  • Application Method
  • Other, Manual or automatic dispensing
  • Color
  • Black
  • Feature
  • Other, High reliability underfill epoxy
  • Main Material
  • Other, Epoxy resin
  • Shelf Life
  • 6 months @ <5C
  • Size
  • 10 cc or 30 cc syringes
  • State
  • Other, Liquid
  • Storage Period
  • Recommended below 5C
  • Style
  • Other, Underfill
  • Surface
  • Other, PCB assemblies, CSP, BGA
  • Usage
  • Underfill for electronics assembly

ECCOBOND FP4531 Underfill Epoxy

MOQ : 10 Units

  • Appearance
  • Liquid
  • Application Method
  • Other, Dispensing system
  • Color
  • Dark
  • Feature
  • Other, High flexural modulus
  • Hard Dry
  • Full cure on heating
  • Main Material
  • Epoxy
  • Scrubbing Resistance
  • High
  • Shelf Life
  • 12 months
  • Size
  • Standard syringe
  • State
  • Other, Viscous
  • Storage Period
  • 12 months
  • Style
  • Other, Industrial
  • Surface
  • Other, Electronic components
  • Thickness
  • Thin layer
  • Usage
  • Underfill for electronics assembly


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