ECCOBOND E 1216M Underfill Epoxy

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MOQ : 10 Units

ECCOBOND E 1216M Underfill Epoxy Specification

Surface
PCB assemblies, CSP, BGA

State
Liquid

Size
10 cc or 30 cc syringes

Feature
High reliability underfill epoxy

Appearance
Liquid

Shelf Life
6 months @ <5C

Usage
Underfill for electronics assembly

Main Material
Epoxy resin

Application Method
Manual or automatic dispensing

Style
Underfill

Color
Black

Storage Period
Recommended below 5C

Typical End Use
Microelectronics

Technologies
Thermosets, electronics

CTE Above Tg
131 ppm/C

Glass Transition Tg
125C

Product Category
Underfills

Cure Type
Heat cure

Work Life
5 days

Viscosity
4000 mPas

CTE Below Tg
35 ppm/C

Suitable For
CSP, BGA underfill

ECCOBOND E 1216M Underfill Epoxy Trade Information

Minimum Order Quantity
10 Units

Payment Terms
Cash in Advance (CID)

Supply Ability
1000 Units Per Month

Delivery Time
7 Days

Main Domestic Market
All India

About ECCOBOND E 1216M Underfill Epoxy

LOCTITE® ECCOBOND E 1216M is a black, epoxy-based composite underfill that can handle high-volume assembly operations where fast-flow filling is required. It cures entirely in a single reflow cycle but is stable enough to be easily shipped and used in large-volume cartridges (up to 0.59 ml/20 oz). Specifically formulated to eliminate anhydride-type curing agents.

Void-free
Retains stability during shipping, storage and use
Snap-curing
High glass transition temperature (Tg)

Optimized for CSP and BGA Applications

ECCOBOND E 1216M is engineered to deliver superior reliability for chip scale package (CSP) and ball grid array (BGA) components. Its design supports precise underfill coverage, safeguarding delicate solder joints in microelectronics from thermal and mechanical stresses-key factors in modern electronics manufacturing.

Superior Performance and Convenience

This underfill epoxy offers a unique balance of high glass transition temperature (125C) and manageable viscosity (4000 mPas), making it suitable for a range of dispensing techniques. Its extended work life of 5 days enhances production efficiency, while the heat cure process ensures rapid, robust bonding during assembly.

Handling and Storage Recommendations

To preserve optimal properties, ECCOBOND E 1216M should be stored at temperatures below 5C. The product is supplied in liquid form within convenient 10 cc or 30 cc syringes, and boasts a 6-month shelf life when properly refrigerated. This makes it ideal for electronic assembly environments and distribution needs in India.

FAQ's of ECCOBOND E 1216M Underfill Epoxy:

Q: How should ECCOBOND E 1216M Underfill Epoxy be applied to electronic assemblies?

A: ECCOBOND E 1216M can be dispensed manually or with automatic equipment onto CSP or BGA devices. Ensure that the surface is clean before application, and that the epoxy flows to completely fill the area beneath components for maximum protection.

Q: What benefits does this underfill epoxy provide for PCB assemblies?

A: This epoxy enhances reliability by protecting solder joints and delicate interconnections from thermal cycling and mechanical stress. Its properties minimize the risk of solder fatigue and improve long-term device performance in electronics.

Q: When should the epoxy be cured, and what method is recommended?

A: After application, the underfill should be cured using a heat cure process as specified by the manufacturer's guidelines. This ensures optimal adhesion and mechanical strength for secure packaging.

Q: What is the typical work life of ECCOBOND E 1216M, and how does this affect production?

A: The product has a work life of 5 days at recommended storage conditions, allowing flexibility for extended processing times in manufacturing without risk of premature curing.

Q: Where can ECCOBOND E 1216M Underfill Epoxy be sourced in India?

A: It is available through authorized distributors, service providers, suppliers, and traders across India specializing in advanced electronics assembly materials.

Q: What are the recommended storage conditions and shelf life for this epoxy?

A: To maintain its effectiveness, store ECCOBOND E 1216M below 5C. When kept under these conditions, it offers a shelf life of up to 6 months.

Q: Why is ECCOBOND E 1216M suitable for use with CSP and BGA devices?

A: Its optimized flow properties, high Tg, and reliable cure performance make it ideal for encapsulating and securing CSP and BGA components, protecting against environmental and mechanical hazards common in electronic assemblies.

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