PA 657 Injection Moulding Compounds

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MOQ : 100 Kilograms

PA 657 Injection Moulding Compounds Specification

Product Type
Encapsulants

Application
Hot melts, polyamide technologies

Melting Point
157C (softening point)

Usage
Encapsulant for flexible substrate

Appearance
Black

Physical Form
Liquid

Properties
Low viscosity, 400% elongation, Shore A 77 hardness

Recommended Substrate
Flexible substrate

Viscosity @ 210C
3700 mPas

Technology Type
Hot melt polyamide

Shore Hardness
77A

Elongation at Break
400%

Operating Temp Range
-40C to 100C

PA 657 Injection Moulding Compounds Trade Information

Minimum Order Quantity
100 Kilograms

Payment Terms
Cash in Advance (CID)

Supply Ability
5000 Kilograms Per Month

Delivery Time
7 Days

Main Domestic Market
All India

About PA 657 Injection Moulding Compounds

TECHNOMELT® PA 657 is a black, high-performance, thermoplastic polyamide. Its low viscosity allows encapsulation of fragile components without causing any damage, making it the ideal choice for low-pressure moulding applications. Perfect when you need excellent adhesion and cold temperature flexibility. Operating temperature is -40°C to 100°C (-40°F to 212°F).

Easy mouldability
Cold temperature flexibility
Good adhesion to a variety of substrates
Excellent moisture resistance
Operating temperature: -40°C to 100°C (-40°F to 212°F)

Outstanding Flexibility and Durability

PA 657 Injection Moulding Compound delivers exceptional flexibility, evidenced by an elongation at break of 400% and a Shore A hardness of 77. This unique balance allows it to endure mechanical stress and repeated deformation without fracture, making it perfect for encapsulating sensitive, flexible substrates in challenging conditions.

High Performance in Varied Environments

Designed for performance between -40C and 100C, PA 657 maintains its integrity across extreme temperatures. Its hot melt polyamide technology ensures stable viscosity and reliable, long-term protection for encapsulated components, making it well-suited for demanding applications and environments.

Versatile Application and Easy Processing

With a softening point of 157C and a low viscosity at typical processing temperatures, PA 657 is easy to mould and work with. This property simplifies its use as an encapsulant for flexible substrates, allowing efficient and consistent coverage for industrial applications. The product is available through distributors, service providers, traders, and suppliers across India.

FAQ's of PA 657 Injection Moulding Compounds:

Q: How is PA 657 Injection Moulding Compound typically applied in industrial processes?

A: PA 657 is applied using hot melt injection moulding technology. The compound is heated to its melting point (157C), enabling its low viscosity and making it easy to inject over flexible substrates to encapsulate and protect delicate electronic or mechanical components.

Q: What benefits does PA 657 offer when used as an encapsulant for flexible substrates?

A: The compound provides superior flexibility (400% elongation at break) and medium hardness (Shore A 77), allowing encapsulated parts to withstand mechanical stress and flexing without losing integrity. Its robust temperature range also ensures performance in a variety of environmental conditions.

Q: When should I consider using PA 657 over other encapsulation materials?

A: PA 657 is ideal when you require high flexibility, reliable adhesion, and protection across a wide temperature range. It is particularly suitable for applications involving flexible substrates or components that may experience movement, frequent handling, or thermal variation.

Q: Where can I source PA 657 Injection Moulding Compounds in India?

A: This product is available from a range of distributors, suppliers, traders, and service providers across India who specialize in hot melt polyamide technologies and encapsulation materials for industrial use.

Q: What is the recommended process for moulding PA 657 compounds?

A: For optimal results, heat PA 657 to its softening point of 157C, ensuring low viscosity for thorough mould coverage. Inject onto the flexible substrate, allow to set, and verify bonding and integrity. Standard hot melt injection moulding equipment is suitable for this process.

Q: What types of applications benefit most from using PA 657?

A: Applications involving delicate, flexible substrates-such as electronics, wiring assemblies, or sensitive mechanical components-benefit greatly from PA 657's flexibility, strong encapsulation, and protective properties.

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