3128 Structural Adhesives

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MOQ : 100 Units

3128 Structural Adhesives Specification

Adhesive Type
Structural adhesive

Storage Temperature
-15.0C - -25.0C

Usage
Structural bonding

Grade
Industrial

Application
Structural bonding

Color
Black

Physical State
Medium viscosity

Technologies
Thermosets, electronics

Number of components
1 part

Product category
Structural adhesives

Cure type
Heat cure

3128 Structural Adhesives Trade Information

Minimum Order Quantity
100 Units

Payment Terms
Cash in Advance (CID)

Supply Ability
5000 Units Per Month

Delivery Time
7 Days

Main Domestic Market
All India

About 3128 Structural Adhesives

LOCTITE® 3128 is a 1-part, heat-curable epoxy designed for use on small, heat-sensitive components. Typical applications include things like memory cards and CCD/CMOS assemblies. It cures at low temperature and gives excellent adhesion on a wide range of materials in a considerably short amount of time. Performs particularly well when low curing temperatures are required for heat-sensitive components.

Excellent adhesion on a wide range of materials
Fast-acting
Perfect for heat-sensitive components
Heat-curable at low temperatures of 80°C (176°F)

Industrial-Grade Bonding for Electronics and Structures

3128 Structural Adhesive combines thermoset chemistry with heat-cure activation to deliver strong, lasting bonds for demanding structural and electronic applications. Its single-component format simplifies preparation and enhances productivity, making it ideal for industrial assembly environments.

Reliable Performance with Simple Application

With medium viscosity and a convenient one-part system, 3128 facilitates efficient handling and precise application. Curing by heat ensures consistent results, enabling secure attachment even under challenging operational conditions.

FAQ's of 3128 Structural Adhesives:

Q: How is 3128 Structural Adhesive typically applied?

A: 3128 Structural Adhesive is applied directly from its container onto the prepared surface in the required area. After application, it must be exposed to the designated heat to initiate the curing process and achieve optimal bond strength.

Q: What are the main benefits of using this adhesive in structural bonding?

A: The primary benefit is its high structural integrity, providing strong, durable bonds suitable for demanding industrial and electronic assembly tasks. Its heat-cure process ensures fast, dependable curing and performance in critical structural applications.

Q: When should I use 3128 Structural Adhesive for my projects?

A: This adhesive is best suited for situations where high shear and peel strength are needed, especially in structural or electronic assemblies that will experience mechanical stress or vibrations. It is also ideal when a reliable, industrial-grade bonding solution is required.

Q: Where can I purchase or source 3128 Structural Adhesive in India?

A: 3128 Structural Adhesive is available through certified distributors, service providers, suppliers, and traders across India. Contacting these professionals will ensure you receive genuine products and appropriate support.

Q: What is the proper process for curing this adhesive?

A: After applying the adhesive, heat must be applied according to the manufacturer's recommended temperature and duration. This activates the thermoset technology, solidifying the adhesive into a robust, structural bond.

Q: What storage conditions are recommended for 3128 Structural Adhesive?

A: To preserve its performance, 3128 Structural Adhesive should be stored at temperatures between -15C and -25C. This helps maintain its medium viscosity and reactivity over time.

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